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Bergdahl Associates, Inc. - Authorized Distributor | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Home > LORD Engineered Adhesives > > Epoxy Adhesive > LORD 209 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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Description Lord® 309 is a general purpose, thixotropic, two-part epoxy adhesive that is used for applications that require gap filling or non-slumping characteristics on a vertical substrate. The cured adhesive offers strong, durable, chemically and environmentally resistant bonds. Lord 309 adhesive has demonstrated excellent adhesion to prepared metals, FRP, wood, prepared rubber, and other materials. Features and Benefits High Strength - provides load bearing properties equal to or greater than the materials being bonded in many instances. Chemically/Environmentally Resistant - resists dilute acids, alkalis, solvents, greases, oils, moisture, sunlight, and weathering. Temperature resistant from -34°C to 121°C (30°F to 250°F). Variable Cure - cures completely at room temperature or much more quickly at elevated temperatures. Excellent Engineering Properties - provides low shrinkage, good creep properties, and low water absorption. For these and other engineering properties. Flexible Mix Ratio - accommodates a range of service temperatures and stress loads through modification of the resin-to-hardener mix ratio.
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Table 1: Typical Properties* of Uncured Lord 309 Adhesive
* Data is typical and not to be used for specifications purposes. LORD 309 Technical Data Sheet For more information about Lord 309 contact Bergdahl Associates, Inc. Date issued: 06/05 |
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